What's New
Find out about the latest updates and improvements to library.io
June 8th, 2018

Added Pad-to-Hole input to Package Generators

Added pad-to-hole ratio to through-hole package generators to allow specifying of pad diameter relative to hole diameter.

Library, Package, and 3D Model Previews

Added previews of libraries, packages, and 3D models to the website. This includes a permanent URL (permalink) for each asset.

Bug fixes and enhancements
  • Fixed searching for 3D models.
May 14th, 2018

Through-Hole Package Generators

The Package Generator now supports the creation of IPC-compliant 2D footprints and 3D models for axial and dual-in-line (DIP) packages.

Bug fixes and enhancements
  • Improvements to Package Generator UI
    • The default unit can now be changed inside the options window.
    • Unit labels have moved inside text input fields to make clearer that users can enter units other than the default unit.
    • Hotkey for select all now works within text input fields.
  • Improvements to Package Rendering
    • Properties (e.g. >NAME and >VALUE) are now rendered in the package editor.
    • Documentation/assembly geometry (the EAGLE tDocu/bDocu layers) is now rendered in the package editor.
  • Improvements to the Package Generator Output
    • Footprint property texts (name and value) are now centered at origin along x-axis.
    • Increased pin 1 marker dot silkscreen size.
    • Thermal flag is now set for pads in generated footprints.
    • MELF diodes are now generated with an appropriate package color.
    • Fixed a rounding issue that would occasionally lead to an incorrect trailing digit in the numerical portions of the generated IPC package names.
  • Error Handling
    • Corrupt / invalid 3D model (STEP) files can no longer be added to a 3D package.
    • Error messages have been improved. Error messages now show the id of the logged in user, the id of the asset being edited, what the user was attempting to do at the time of the error, details about what went wrong, and a link to Autodesk support.
    • Fixed a bug in the package editor that prevented users from uploading the same step file twice in a row.
March 27th, 2018

User dashboard search

Added search capabilities to the user dashboard. Advance filters can be applied to packages.

Bug fixes and enhancements
  • Improvements to Package Generator UI
    • Min and max input fields are placed in a single row for Package Generator parameters.
    • The dimensioned package image is always visible when scrolling through the input form.
    • The camera position is preserved when updating the preview, making it easier to compare packages before and after changes.
  • Improvements to the Package Generator output
    • The Package Generator now uses alphanumeric pin numbering for BGA packages.
    • Generated silkscreen is now correctly mapped to the package body for DFN-2/3/4 and MELF packages.
    • The redundant pin 1 marker was removed from the silkscreen for generated molded body packages.
    • Fixed clearance of pin 1 marker from other silkscreen.
  • Fixed scroll to zoom in Firefox.
  • Fixed an issue that caused sporadic unauthorized errors to appear in package editor.
  • Fixed an issue that caused Safari to download exported 3D package library files with the "xml" extension instead of "lbr."
  • Now showing a loading screen while exporting a 3D package library file.
  • Search results now show asset summaries, not descriptions.
  • Fixed an issue that slowed loading of the Package Generator, search, and editor web pages.
March 8th, 2018

Initial Release

Create manufacturing-ready footprints & 3D models. Instantly generate PCB packages by entering a few dimensions from a data sheet.