Added pad-to-hole ratio to through-hole package generators to allow specifying of pad diameter relative to hole diameter.
Added previews of libraries, packages, and 3D models to the website. This includes a permanent URL (permalink) for each asset.
The Package Generator now supports the creation of IPC-compliant 2D footprints and 3D models for axial and dual-in-line (DIP) packages.
Added search capabilities to the user dashboard. Advance filters can be applied to packages.
Create manufacturing-ready footprints & 3D models. Instantly generate PCB packages by entering a few dimensions from a data sheet.